As Fig. 3 shows, if the left and right lands (the part of the printed circuit board on which a copper foil pattern-the component-is mounted) are of different dimensions (surface area/shape), the tension acting on the left and right electrodes will differ during soldering, leading to a standing chip. It is important to follow. During the process of printing solder paste on a printed circuit board, if the amount of solder is uneven on the left and right, as in Fig. 4, the tension acting on the left and right electrodes will differ. When mounting components on a printed circuit board with a mounter, slightly faulty positioning is self-corrected by the surface tension when solder is melted in the reflow process. However, if the positioning error is greater than the. If the temperature of the reflow oven (which heats the solder to melt it) rises too quickly, the temperature inside the reflow oven will be unstable and there could be temperature variations among component terminals, depending on.